For high-dense relay applications, we offer a lower coil power version supporting reduction of overall switching power supporting environmental power reduction targets. To support high-density technology footprints, we are now offering a narrow PCB solder configuration in a THT and SMD version. It is available in a through-hole (THT) and surface mount (SMD) version for use on printed circuit boards (PCBs). These relays can support battery powered applications, with a bistable relay for reducing the consumption of constant power. Our Axicom IM relays are available in a range of contact structures (1 form A, 2 form A, 1 form C, 2 form C) with a lower cost impact compared to using solid state relays. This electromechanical relay is designed to address the need for small components that can fit into increasingly smaller technology applications. This versatile electromechanical relay supports multiple contact configurations and is engineered for high volume applied technologies, such as automotive infotainment systems, communications equipment, consumer electronics, building management systems, test and measurement machinery, and medical devices. These feature a shock-resistant design that can withstand shocks of up to 300 g-force, making a feasible solution for industrial applications.
These products feature low coil power consumption supporting high density relay applications by reducing overall power consumption. Our Axicom IM relays reliably and efficiently offer switch signal and low power in a small, low profile design.
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